- wafer dicing tape-UV tape
- [2014-06-30]
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Wafer dicing tape used for semiconductor in the cutting process of fixing the workpiece, manufacturing of optical and electrical equipment.
High technology is necessary, to the development of the cutting zone diversifiedhigh quality chip, according to the work of each type of requirements. CuttingSuzhou Yingjun optoelectronic generated am am adhesive tape products widely used for cutting and EMC package substrate, low temperature co fired ceramic substrate, drive IC, silicon wafer, ceramic, glass, etc. the monolithic lens.
Especially UV series of wafer dicing tape enabled strong holding power, easy peeling without residue, by disabling adhesion of ultraviolet irradiation. Wafer cutting protective film with antistatic requirements. Wafer dicing tape provided to you not only in the roller, but also roll pre cut, sheet and other forms of.
We Kunshan depin packaging materials electric considers each user needs,select the appropriate wafer dicing tape.
last锛The wafer cutting machine
next锛HTC Profitability
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