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Wafer cutting machine

Introduction of apparatus

Objective one.

Wafer cutting purposes, mainly to each grain on the wafer (Die) by cutting. First of all to the wafer (Wafer) is stuck with a layer of adhesive tape (Wafer Mount),and then send it to the wafer cutting machine to cut. After the grain cutting, onewill in order arrangement paste on the adhesive tape, and the frame can avoidgrain for tape wrinkles arising from the collision, in favour of handling process.This experiment has the structure, usage and correct way to understand the cutting machine.

Principle two.

Wafer cutting machine is the equipment is very precise, the spindle speed is about 30000 to 60000rpm, the grain and grain distance is very small and the grain is very fragile, therefore, very high precision, and must use the diamondblade for cutting, grinding and cutting by the way of the grains separated.Because the system adopts grinding way cutting, will produce pink crumbs many,therefore in the cutting process must constantly flush with water, in order to avoid the pollution to the grain. In addition to the above points, during the cutting process should be noticed quite a lot, such as grain completely segmentation but not cut the tape bearing, cutting must be along the grain and grain between thecutting line can not deviate from and hunting, cutting can not be after thecollapse caused by grain or crack etc.. To solve the problems mentioned above,the loss of all kinds of automatic detection, automatic adjustment and automatic cleaning of equipment will be applied to the machine in order to reduce the errorcaused by the cutting.

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