100#PO film UV tape-Low- 100#PO Film UV tape-High
150#PO film UV tape-Low
150#PO film UV tape-High
100#PET film UV cut tape-Low- 100#PET film UV tape-High
UTGT252510
UTGT252520
Presentation
Our company increased R & D team and dust-free workshop for solutions of UV dicing tape (such as wafer dicing tape, glass cutting tape), according to the process and the product you need flexible substrate (PO PET PVC) and glue, our production of solution of UV adhesive tape cutting materials than the single price of goods into the material better.
Solution of UV tape is designed for wafer grinding, cutting, precision electronic parts bearing machining micro parts processing and all kinds of material cutting and design. Special adhesive coating, high adhesion, cutting with strong adhesion is stuck even small wafer wafer no displacement or stripping the wafer grinding, cutting off, not fly and really cut. After the end of processing, as long as the ultraviolet irradiation amount instantly reduce the adhesion, even large wafer can be used easily correct pickup and no adhesive residue retting pollution, improve the picking up of picking up the crystal, no adhesive contamination caused by pollution, not because of ultraviolet irradiation on IC has bad effects the.
Characteristic.
* when cutting high adhesion, low viscosity to pick up after UV irradiation wafer not fly, no adhesive residue.
* fast irradiation UV reaction time, improve work efficiency.
Matters needing attention
A) in the tape before the adherend surface greasy dirt, dust, moisture and other clean.
Two) tape under sunlight irradiation adhesion in a short period of time will decrease, so the tape storage, must be put in the shading bag, placed in a cool place.
Three) tape when in use, please put the environment temperature control in 10 鈩 to 30 鈩. In this temperature environment when in use, will cause the poor bonding.
Four) the rubber surface when using do not directly with the hand to touch the adhesive tape.
