• The popular product UV film
  • [2014-06-28]
  • Kunshan depin packaging materials Limited new increase R & D team and dust-free workshop production solution UV tape (such as wafer dicing tape, glass cutting tape), according to the process and the product you need flexiblesubstrate (PO PET PVC) and glue, our production of solution UV cut cut tapematerials imported materials. Compared with the single price.

    Solution of UV tape is designed for wafer grinding, cutting, precision electronic parts bearing machining micro parts processing and various material cutting anddesign. The special glue coating, high adhesion, cutting to a strong adhesion didstick wafer even small chip will not displace or stripping the wafer grinding, cuttingoff, not fly and really cut. After the end of processing, as long as the ultravioletirradiation amount instantly reduced adhesion, even large wafer can be easily with the right to pick up and no adhesive residue retting contaminated, increase the detection when crystal pick-up, no adhesive contamination caused by pollution, but not because of ultraviolet irradiation and cause a bad influence on the IC the.

    Characteristic.

    * when cutting high adhesion, low viscosity to pick up after UV irradiation wafernot fly, no adhesive residue.

    * fast irradiation UV reaction time, improve work efficiency.

    Matters needing attention

    A) in the tape before you will be greasy, sticky surface dust, moisture and otherclean.

    Two) tape in sunlight adhesion in a short period of time will decrease, so the tapestorage, must be put in the bag, placed in the shade.

    Three) tape when in use, please put the environment temperature control in 10鈩 to 30 鈩. In this temperature environment when in use, will cause the bad bonding.

    Four) the rubber surface when using do not directly with the hand touch theadhesive tape.

    Five) posted the wrong position, please use the new tape, avoid the tape again.



    last锛The company selling the product introduction

    next锛The wafer cutting machine

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