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UV film (UV dicing tape) is a special formulation of coating PET film to the substrate surface, in order to achieve the effect of blocking ultraviolet light andshort wavelength visible light. Suitable for optical etching process or process toisolate UV industries such as semiconductor industry, electronic industry, etc.. To avoid improper light leakage caused by bad quality product.

Application of the UV film on silicon integrated circuit encapsulation process ofcutting and subsequent transport process

● keep grain in the cutting of integrity, (without any grain loss) resulting from a decrease in the broken cutting

● ensure grain in the normal transfer process, not a case, falling between the displacement, water will not penetrate into the grain and tape

● UV film does not have the residual gum phenomenon

last：UV film (UV used in the wafer cutting dicing tape)

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