• UV film (UV used in the wafer cutting dicing tape)
  • [2014-07-18]
  • Wafer cutting (Wafer Dicing) UV cutting use.

    Wafer slicing (wafer dicing).

    During the past thirty years, slice (dicing) system and the blade (blade) has beencontinuously improved to cope with challenges and acceptance process of different types of substrate requirements. Including equipment update, the biggest impact on Productivity: the two cutting (two cuts) performed at the same time, the distance (overtravel) is reduced to the minimum axis (dual-spindle)slices system; automatic spindle torque monitoring and automatic coolant flowadjustment ability. A significant slice blade progress includes some razor blades,they used very narrow and / or higher chip the size of a wafer to wafer, copper metallization, very thin wafer, and in section for surface polishing device wafer.Many of today's demanding applications require two aspects of equipment capacity and blade properties

    The optimization of process, to the lowest possible cost efficiency as high as possible.

    UV film (UV dicing tape) in the cutting process is essential, to a certain extent, the cutting process is successful or not is depend on the UV membrane (UV dicing tape) selection.



    last锛OGS two strengthen technical analysis

    next锛UV鑶滐紙UV鍒囧壊鑳跺甫锛夌殑鐙壒鐗规

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